•  
    Monday 22 June
    8:30 - 10:30 IRT/C2MI Session 1 3D Packaging
    11:00 - 12:30 Session 2 3D Technology
    12:00 - 13:30 Lunch
    14:00 - 15:45
    Common
    IRT/C2MI
    D43D
    		 Session 3 3D Technology for Photonics
    16:15 - 18:00 Session 4 3D CAD tools & Design
    19:00 - 23:00 D43D Gala Diner
    Tuesday 23 June
    8:30 - 10:30 D43D Session 5 3D Architecture
    11:00 - 12:30 Session 6 3D Advanced Design
    12:00 - 13:30 Lunch
    14:00 - 15:45 D43D Session 7 3d Photonic Architectures
    16:15 - 18:00 Session 8 3D Imagers

     


  •  
    IRT/C2MI & D43D WORKSHOP
    22 June, 2015

    Paradigms for 3D integration
     
    MONDAY, JUNE 22 2015

    Morning Session is IRT/C2MI workshop only
    Afternoon Session is shared between IRT/C2MI and D43D workshops
     
    SESSION 1 3D Packaging
    Chair : Didier Louis - IRT-CEA LETI, France
    8:30-9:00 a.m. Truly Hermetic Wafer Level Package Technology Sebastien Michel - Teledyne Dalsa Semiconductor, CA
    9:00-9:30 a.m. Photonics packaging development at STMicroelectronics Laurent Maréchal - STMicroelectronics, France
    9:30-10:00 a.m. On the path towards scalable 3D integration by advanced packaging Thomas Brunschwiler - IBM Zurich, Germany
    10:00-10:30 a.m. Enhanced TSV Last technology for heterogeneous integration : Hi-rel and power device, RF applications Gilles Simon - CEA-LETI, France
    10:30-11:00 a.m. COFFEE BREAK
     
    SESSION 2 3D Technology
    Chair: Dominique Drouin - Univ. Sherbrooke, Canada
    11:00-11:30 a.m. Fine pitch assembly for 3D Integration – The ‘finer’ points David Danovitch - Univ. Sherbrooke, Canada
    11:30-12:00 a.m. New opportunities in 3D integrations Jean Michailos - STMicroelectronics, France
    12:00-12:30 a.m. Advanced silicon interposer Severine Cheramy - CEA-LETI, France
    12:30-14:00 a.m. LUNCH BREAK
     
    SESSION 3 3d Technology for Photonics & Characterization
    Chair: Severine Cheramy – CEA-LETI, France
    14:00-14:25 p.m. Optical interconnect packaging for Silicon Photonic devices using existing microelectronic assembly infrastructure Paul Fortier - IBM, Canada
    14:25-14:50 p.m. Silicon Photonics for high data rate applications : from chip to module Stephane Bernabé - CEA-LETI, France
    14:50-15:15 p.m. Virtual Qualifications With Applications to 3Di Julien Sylvestre - Univ. Sherbrooke, Canada
    15:15-15:40 p.m. Hybrid materials for packaging Isabelle Bord-Majek - IMS Bordeaux, France
    15:45-16:15 p.m. COFFEE BREAK
     
    SESSION 4 3D CAD tools & Design
    Chair: Pascal Vivet - CEA-Leti, France
    16:15-16:40 p.m. A Modern Approach to Chip-Package-Board Co-Optimization John Park - Mentor Graphics, USA
    16:40-17:05 p.m. CAD Methodology for design of 3D ICs, leveraging existing 2D design flows Ravi Varadarajan - Atrenta, USA
    17:05-17:30 p.m. A novel EDA Flow for Automatic 3D Space Partitioning and 3D DRC for Smart System Solutions Stefano Pettazzi - Silvaco, UK
    17:30-18:00 p.m. Die-stacking architecture for future GPU design Yuan Xie - Santa Barbara University, USA
    19:00-23:00 p.m. D43D GALA DINNER

     
  •  
    D43D WORKSHOP
    23 June, 2015

    DESIGN-FOR-3D
     
    TUESDAY, JUNE 23 2015

     
    SESSION 1 3D Architecture
    Chair: Vasileios Pavlidis - Manchester University, UK
    8:30-9:00 a.m. The Vision of EuroServer, and the implications to future nanotech integration and high performance computing John Goodacre - ARM Limited, UK
    9:00-9:30 a.m. Diagnosis, Protection, and Configurability of I/O Circuits for 3D Chip Stacking Makoto Nagata - Kobe University, Japan
    9:30-10:00 a.m. Design Space Exploration for 3D Integrated or Advanced Packaged Systems Andy Heinig - Fraunhofer, Germany
    10:00-10:30 a.m. Multi-layer TSV Repair – Towards an Error Resilience Exploration Process Mounir Benabdenbi - TIMA, France
    10:30-11:00 a.m. COFFEE BREAK
     
    SESSION 2 3D Advanced Design
    Chair: Denis Dutoit - CEA-LETI, France
    11:00-11:30 a.m. Advanced Modelling of 3D stacked DRAM and Efficient Thermal Management of 3D-ICs Christian Weis - UKL, Germany
    11:30-12:00 a.m. Active Interposers for ManyCore Architecture: Challenges and Results Pascal Vivet - CEA-LETI, France
    12:00-12:30 a.m. A Ultra-Low-Power FPGA Based on Monolithically Integrated RRAMs Pierre-Emmanuel Gaillardon - EPFL, Switzerland
    12:30-14:00 a.m. LUNCH BREAK
     
    SESSION 3 3d Photonic Architectures
    Chair : Sebastien Le Beux - INL, France
    14:00-14:25 p.m. More-than-Moore with 3D silicon-photonics Vladimir Marko Stojanovic - Berkeley University, USA
    14:25-14:50 p.m. Cross-Layer Temperature Awareness for 3D-Stacked Systems with Silicon-Photonic NoCs Ayse Coskun - Boston University, USA
    14:50-15:15 p.m. Hybrid integration of optical networks on silicon interposers for multi-die systems-on-chip Yvain Thonnart - CEA-LETI, France
    15:15-15:40 p.m. Addressing the System-ability gap of optical networks-on-chip in 3D manycore systems through cross-layer design and benchmarking methods Davide Bertozzi - Ferrara university, Italy
    15:45-16:15 p.m. COFFEE BREAK
     
    SESSION 4 3D Imagers
    Chair: Gilles Sicard - CEA-Leti, France
    16:15-16:40 p.m. CMOS-3D Architectures for Vision Sensor Chips and Feature Detection Victor Brea - Santiago de Compostela Univ., Spain
    16:40-17:05 p.m. High-Density 3D Interconnects Technology Benefits for Specific CMOS Image Sensors Philippe Martin-Gonthier - ISAE - Toulouse, France
    17:05-17:30 p.m. Smart Retina in 3D technology Stéphane Chevobbe - CEA-LIST, France

     

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  • For further information

    LetiDays Registration LetiDays Organization
    INSIGHT OUTSIDE
    39 chemin du vieux chêne - 38240 Meylan
    Tel: +33 825 595 525 (0,15€/min*) - Fax: +33 4 38 38 18 19
    Email: contact@letidays.com
    Web site: http://www.insight-outside.fr

    Information desk
    Monday to Friday from 2:00pm to 5:00pm         		CEA-Leti
    17 rue des Martyrs
    F-38054 Grenoble Cedex 9
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    Web site: http://www.leti.fr
    (*) Prices starting from fixed line incumbent, a surcharge may be applied by operators, counting the second after the first 45 seconds.

    According to France's Personal Data Privacy Act in effect since June 2004, you may send a request in writing to INSIGHT OUTSIDE 39 chemin du vieux chêne, 38240 Meylan / France, or by email webmaster@insight-outside.fr to access your file in order to consult, modify and/or delete your personal information.

    © 2005 - 2015 Insight Outside