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15th Leti Annual Review
Design for 3D (D43D)
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Workshop on Photonics
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Presentations
CEA-Leti is hosting its first workshop on silicon photonics at MINATEC on Thursday, June 27, 2013.
Being a key player in Silicon photonics, CEA-Leti has been developing a design, technology and packaging platform for a decade.
This workshop will explore the latest achievements and address the different challenges that silicon photonics is facing in terms of design, fabrication and packaging.
It will also feature invited presentations by leaders in silicon photonics applications and technology
Program
9:00
Communication Technology Roadmap status and outcomes
Lionel Kimerling, MIT
9:30
Silicon Photonics markets and applications
Eric Mounier, Yole Développement (Senior Analyst)
10:00
How could Silicon Photonics solve the bottlenecks in Datacenters and Supercomputers ?
Patrick Demichel, HP (Senior architect HPC for EMEA at HP)
10:30
BREAK
11:00
Design tools for Silicon Photonics
Alexandre Arriordaz, Mentor Graphics
11:30
Low power IC design
Sylvie Menezo, CEA
12:00
Silicon Photonics for Many-cores architectures in future micro-servers
Yvain Thonnart, Leti
12:30
LUNCH BREAK
14:00
Silicon-based packaged products and solutions
Yves Painchaud, Teraxion
14:30
Integration of laser sources on silicon
Badhise Ben Bakir, Leti
15:00
300mm CMOS Platform Delivers 25 Gbps /Channel Silicon Photonic Integrated Transceivers
Charles Baudot, ST (Advanced R&D Staff Engineer / STMicroelectronics Crolles, Silicon Technology Development, Process Integration)
15:30
BREAK
16:00
Photonic/electronic integration for High Performance Computing applications
Bert Offrein, IBM
16:30
3D integration for silicon photonics
Yann Lamy, Leti
17:00
Packaging challenges for next generation Photonics modules
Stéphane Bernabé, Leti
17:30
END OF THE WORKSHOP
You can consult the list of participants
here
For further information
Registration & Accommodation
Organization
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